| ORIGINAL ARTICLE |
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| Year : 2014 | Volume
: 3
| Issue : 5 | Page : 17-22 |
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Evaluation of thickness of hybrid layer and length of resin tags of three adhesives to the root canal dentin: An in vitro scanning electron microscopic study
Sowmya Kallepalli1, Shreemoy Dash2, Sujatha Gopal1, N.B.P. Surya Kumari1
1 Department of Conservative Dentistry and Endodontics, MNR Dental College & Hospital, Sangareddy, Andhra Pradesh, India
2 Department of Conservative Dentistry and Endodontics, St. Joseph Dental College and Hospital, Eluru, Andhra Pradesh, India
Correspondence Address:
Sowmya Kallepalli
105, Rose Quratz, My Home Jewel, Madinaguda, Hyderabad - 500 050, Andhra Pradesh
India
 Source of Support: None, Conflict of Interest: None  | Check |
DOI: 10.4103/2277-8632.128485
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Objectives: This present study was done to evaluate the resin-dentin interface of three adhesive systems used for bonding the root canal under scanning electron microscopic (SEM).
Materials and Methods: Sixty single-rooted human maxillary anterior teeth were decoronated at the cementoenamel junction apical preparation done up to 60 no. K-file and obturated with cold lateral compaction of gutta-percha and resin sealer (AH Plus). The specimens were then randomly divided into four groups of 15 teeth each. Group I-"Etch and rinse" adhesive system Group II-"Self-etch" adhesive system Group III-"Resin modified glass ionomer" adhesive system Group IV-"No adhesive system" used (control). All the adhesive systems were light cured then fiber posts were luted with dual cure resin cement and the specimens were prepared for SEM examination at magnifications ×1500 and ×5000 at coronal, middle and apical thirds of root canal.
Results: Statistical analysis was performed using one-way ANOVA followed by post-hoc Tukey's honestly significant difference test. Group I showed highly statistical significant difference when compared with other groups.
Conclusion: Maximum thickness of hybrid layer and long resin tags were shown by etch and rinse adhesives followed by self-etch adhesives. |
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